ZHCSMV0A August 2021 – May 2022 CDCDB803
PRODUCTION DATA
| THERMAL METRIC(1) | Device Package | UNIT | |
|---|---|---|---|
| RSL (QFN) | |||
| 48 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 32.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 22.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 14.3 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 14.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 6.1 | °C/W |