ZHCSJJ0C August 2000 – March 2024 BUF634
PRODUCTION DATA
| THERMAL METRIC(1) | BUF634 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | KC (TO-220) | KTT (TO-263) | |||
| 8 PINS | 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 123 | 32.1 | 41.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 55 | 25.6 | 45 | °C/W |
| RθJB | Junction-to-board thermal resistance | 68 | 18.3 | 24.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 12 | 8.5 | 13.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 67 | 17.7 | 23.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 0.7 | 2.4 | °C/W |