ZHCSJJ0C August 2000 – March 2024 BUF634
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics: TO-220 and TO-263 Packages
- 6.6 Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package
- 6.7 Electrical Characteristics: Low-Quiescent-Current Mode for SOIC Package
- 6.8 Typical Characteristics: TO-220 and TO-263 Packages
- 6.9 Typical Characteristics: SOIC Package
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
- KTT|5
訂購信息
9.6 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當的預防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細微的參數更改都可能會導致器件與其發布的規格不相符。 |