ZHCSE65B August 2015 – November 2018
PRODUCTION DATA.
| THERMAL METRIC(1) | bq78350-R1 | UNIT | |
|---|---|---|---|
| TSSOP (DBT) | |||
| 30 PINS | |||
| RθJA, High K | Junction-to-ambient thermal resistance | 81.4 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 16.2 | |
| RθJB | Junction-to-board thermal resistance | 34.1 | |
| ψJT | Junction-to-top characterization parameter | 0.4 | |
| ψJB | Junction-to-board characterization parameter | 33.6 | |
| RθJC(bottom) | Junction-to-case(bottom) thermal resistance | n/a | |