ZHCSG63C December 2013 – July 2018
PRODUCTION DATA.
| THERMAL METRIC(1) | bq51003 | UNIT | |
|---|---|---|---|
| YFP (DSBGA) | |||
| 28 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 58.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 9.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 8.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |