ZHCSMD3C June   2020  – August 2022 BQ25792

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 說(shuō)明（續(xù)）
6. 6 Device Comparison
7. 7 Pin Configuration and Functions
8. 8 Specifications
   1. 8.1 Absolute Maximum Ratings
   2. 8.2 ESD Ratings
   3. 8.3 Recommended Operating Conditions
   4. 8.4 Thermal Information
   5. 8.5 Electrical Characteristics
   6. 8.6 Timing Requirements
   7. 8.7 Typical Characteristics
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1  Device Power-On-Reset
      2. 9.3.2  PROG Pin Configuration
      3. 9.3.3  Device Power Up from Battery without Input Source
      4. 9.3.4  Device Power Up from Input Source
         1. 9.3.4.1 Power Up REGN LDO
         2. 9.3.4.2 Poor Source Qualification
         3. 9.3.4.3 ILIM_HIZ Pin
         4. 9.3.4.4 Default VINDPM Setting
         5. 9.3.4.5 Input Source Type Detection
            1. 9.3.4.5.1 D+/D– Detection Sets Input Current Limit
            2. 9.3.4.5.2 HVDCP Detection Procedure
            3. 9.3.4.5.3 Connector Fault Detection
      5. 9.3.5  Dual-Input Power Mux
         1. 9.3.5.1 ACDRV Turn On Condition
         2. 9.3.5.2 VBUS Input Only
         3. 9.3.5.3 One ACFET-RBFET
         4. 9.3.5.4 Two ACFETs-RBFETs
      6. 9.3.6  Buck-Boost Converter Operation
         1. 9.3.6.1 Force Input Current Limit Detection
         2. 9.3.6.2 Input Current Optimizer (ICO)
         3. 9.3.6.3 Pulse Frequency Modulation (PFM)
         4. 9.3.6.4 Device HIZ State
      7. 9.3.7  USB On-The-Go (OTG)
         1. 9.3.7.1 OTG Mode to Power External Devices
      8. 9.3.8  Power Path Management
         1. 9.3.8.1 Narrow VDC Architecture
         2. 9.3.8.2 Dynamic Power Management
      9. 9.3.9  Battery Charging Management
         1. 9.3.9.1 Autonomous Charging Cycle
         2. 9.3.9.2 Battery Charging Profile
         3. 9.3.9.3 Charging Termination
         4. 9.3.9.4 Charging Safety Timer
         5. 9.3.9.5 Thermistor Qualification
            1. 9.3.9.5.1 JEITA Guideline Compliance in Charge Mode
            2. 9.3.9.5.2 Cold/Hot Temperature Window in OTG Mode
      10. 9.3.10 Integrated 16-Bit ADC for Monitoring
      11. 9.3.11 Status Outputs ( STAT, and INT)
          1. 9.3.11.1 Charging Status Indicator (STAT Pin)
          2. 9.3.11.2 Interrupt to Host ( INT)
      12. 9.3.12 Ship FET Control
          1. 9.3.12.1 Shutdown Mode
          2. 9.3.12.2 Ship Mode
          3. 9.3.12.3 System Power Reset
      13. 9.3.13 Protections
          1. 9.3.13.1 Voltage and Current Monitoring
          2. 9.3.13.2 Thermal Regulation and Thermal Shutdown
      14. 9.3.14 Serial Interface
          1. 9.3.14.1 Data Validity
          2. 9.3.14.2 START and STOP Conditions
          3. 9.3.14.3 Byte Format
          4. 9.3.14.4 Acknowledge (ACK) and Not Acknowledge (NACK)
          5. 9.3.14.5 Target Address and Data Direction Bit
          6. 9.3.14.6 Single Write and Read
          7. 9.3.14.7 Multi-Write and Multi-Read
   4. 9.4 Device Functional Modes
      1. 9.4.1 Host Mode and Default Mode
      2. 9.4.2 Register Bit Reset
   5. 9.5 Register Map
      1. 9.5.1 I2C Registers
10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
          1. 10.2.2.1 Inductor Selection
          2. 10.2.2.2 Input (VBUS / PMID) Capacitor
          3. 10.2.2.3 Output (VSYS) Capacitor
       3. 10.2.3 Application Curves
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13Device and Documentation Support
    1. 13.1 Device Support
       1. 13.1.1 第三方產(chǎn)品免責(zé)聲明
    2. 13.2 Documentation Support
       1. 13.2.1 Related Documentation
    3. 13.3 接收文檔更新通知
    4. 13.4 支持資源
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 術(shù)語(yǔ)表
14. 14Mechanical, Packaging, and Orderable Information