ZHCSMQ1A april 2020 – april 2021 BQ25170
PRODUCTION DATA
| THERMAL METRIC(1) | BQ25170 | UNIT | |
|---|---|---|---|
| DSG | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance (EVM(2)) | 37 | °C/W |
| RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 75.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 93.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 41.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 3.8 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 41.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 17.0 | °C/W |