ZHCSKL0D December 2009 – December 2019 BQ24610 , BQ24617
PRODUCTION DATA.
| THERMAL METRIC(1) | BQ2461x | UNIT | ||
|---|---|---|---|---|
| RGE [VQFN] | ||||
| 24 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 43 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 54.3 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 20 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 0.6 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 19 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4 | °C/W | |