TPS2HCS08-Q1
具有 I2T 線保護(hù)、低 IQ 模式和 SPI 的汽車(chē)級(jí)雙通道 8.9m? 智能高側(cè)開(kāi)關(guān)
TPS2HCS08-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C to 125°C
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- Withstands 36V load dump
- Dual-channel SPI controlled smart high-side switch with integrated nFETs.
- Integrated wire-harness protection without MCU involvement and a SPI programmable fuse curve
- Protection against persistent overload condition
- Improve system level reliability through SPI programmable adjustable overcurrent protection
- SPI configurable capacitive charging mode to drive a wide range of capacitive input ECUs load current needs.
- Low quiescent current, low power ON-state to supply always-ON loads with automatic wake on load current increase with wake signal to MCU
- Robust integrated output protection:
- Integrated thermal protection
- Protection against short-to-ground
- Protection against reverse battery events including automatic switch on of FET with reverse supply voltage
- Automatic shut off on loss of battery and ground
- Integrated output clamp to demagnetize inductive loads
- Digital sense output via SPI can be configured to measure:
- Load current accurately with integrated ADC
- Output or supply voltage, FET temperature
- Provides full fault diagnostics through SPI interface and indication through FLT pin
- Detection of open load and short-to-battery
The TPS2HCS08-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI) and is intended for power distribution and actuator drive applications. The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection configurable via SPI with sufficient flexibility to support loads that require large inrush currents and provide improved protection. The device also integrates a programmable fuse profile (current versus time) that turns off the switch under persistent overload condition. The two features together allow optimization of the wire harness for any load profile with full protection.
The device supports a SPI-configurable capacitive charging mode for ECU loads in power distribution switch applications. The device also includes two low power mode (LPM) states, an auto entry mode or a manual entry mode, that enables the device to provide current to the load ECU while only consuming about 10–20µA of current.
The TPS2HCS08-Q1 device also provides a high accuracy digital current sense over SPI that allows for improved load diagnostics. By reporting load current and the channel output voltage and output FET temperature to a system MCU, the device enables diagnosis of switch and load failures.
The TPS2HCS08-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.
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技術(shù)文檔
| 類(lèi)型 | 標(biāo)題 | 下載最新的英語(yǔ)版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | TPS2HCS08-Q1 8.9mΩ , Automotive Dual-Channel , SPI Controlled High-Side Switch With Integrated I2T Wire Protection and Low Power Mode 數(shù)據(jù)表 | PDF | HTML | 2025年 5月 15日 | ||
| 應(yīng)用手冊(cè) | 利用智能高側(cè)開(kāi)關(guān)為電容負(fù)載充電 | PDF | HTML | 英語(yǔ)版 | PDF | HTML | 2025年 11月 7日 | |
| 應(yīng)用手冊(cè) | 使用 TI 汽車(chē)智能電子保險(xiǎn)絲在低輸出電流下進(jìn)行高精度電流檢 測(cè) | PDF | HTML | 英語(yǔ)版 | PDF | HTML | 2025年 11月 6日 | |
| 白皮書(shū) | 軟體定義車(chē)輛將汽車(chē)電子的未來(lái)推入正軌 (Rev. B) | PDF | HTML | 2025年 1月 29日 | |||
| 白皮書(shū) | ??? ????? ??? ??? ????? ?? ?? (Rev. B) | PDF | HTML | 2025年 1月 29日 | |||
| 功能安全信息 | TPS2HCS08-Q1 Functional Safety FIT Rate, FMD and Pin FMA | PDF | HTML | 2024年 7月 8日 | |||
| 技術(shù)文章 | eFuse 如何協(xié)助推動(dòng)軟體定義車(chē)輛的區(qū)域架構(gòu)革命 | PDF | HTML | 2024年 5月 17日 | |||
| 技術(shù)文章 | eFuse? ????? ?? ??? ?? ???? ??? ??? ?? | PDF | HTML | 2024年 5月 16日 |
設(shè)計(jì)和開(kāi)發(fā)
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HSS-2HCS08EVM — TPS2HCS08-Q1 智能保險(xiǎn)絲高側(cè)開(kāi)關(guān)子卡
HSS-HCMOTHERBRDEVM — 智能保險(xiǎn)絲評(píng)估模塊
HSS-HCMOTHERBRDEVM 和相應(yīng)的子卡(例如 HSS-2HCS10EVM)用于展示和評(píng)估德州儀器 (TI) 智能保險(xiǎn)絲高側(cè)開(kāi)關(guān)產(chǎn)品系列的所有功能。主板旨在與多個(gè)不同子卡一起使用,從而可以將單個(gè)主機(jī) EVM 用于具有不同導(dǎo)通電阻和功能的各種不同高側(cè)開(kāi)關(guān)。
HSS-HCS-BLANKEVM — 適用于智能保險(xiǎn)絲開(kāi)關(guān)產(chǎn)品系列的空載評(píng)估模塊
HSS-SMART-CONFIGURATOR — Configuration tool for the HSS-HCMOTHERBRDEVM and TI's smart fuse high-side switches
支持的產(chǎn)品和硬件
產(chǎn)品
高側(cè)開(kāi)關(guān)
硬件開(kāi)發(fā)
評(píng)估板
HCS-HEADER-FILES — C Header files for smart fuse high-side switches with register definitions
支持的產(chǎn)品和硬件
產(chǎn)品
高側(cè)開(kāi)關(guān)
硬件開(kāi)發(fā)
評(píng)估板
子卡
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TIDA-020079 — 區(qū)域參考設(shè)計(jì)
| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| HTSSOP (PWP) | 16 | Ultra Librarian |
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- MTBF/時(shí)基故障估算
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