產品詳情

Sampling rate (max) (kHz) 192 Control interface I2C Architecture Class-D Operating temperature range (°C) -40 to 85 Rating Catalog
Sampling rate (max) (kHz) 192 Control interface I2C Architecture Class-D Operating temperature range (°C) -40 to 85 Rating Catalog
VQFN (RHB) 32 25 mm2 5 x 5
  • Stereo Audio DAC with 95-dB SNR
  • Supports 8-kHz to 192-kHz Sample Rates
  • Mono Class-D BTL Speaker Driver (2.5 W Into 4-Ω or 1.6 W Into 8-Ω)
  • Two Single-Ended Inputs With Mixing and Output Level Control
  • Stereo Headphone/Lineout and Mono Class-D Speaker Outputs Available
  • Microphone Bias
  • Headphone Detection
  • 25 Built-in Digital Audio Processing Blocks (PRB_P1 – PRB_P25) Providing Biquad and FIR Filters, DRC, and 3-D Structures
  • Digital Mixing Capability
  • Pin Control or Register Control for Digital-Playback Volume-Control Settings
  • Digital Sine-Wave Generator for Beeps and Key Clicks (PRB_P25)
  • Programmable PLL for Flexible Clock Generation
  • I2S, Left-Justified, Right-Justified, DSP, and TDM Audio Interfaces
  • I2C Control With Register Auto-Increment
  • Full Power-Down Control
  • Power Supplies:
    • Analog: 2.7 V–3.6 V
    • Digital Core: 1.65 V–1.95 V
    • Digital I/O: 1.1 V–3.6 V
    • Class-D: 2.7 V–5.5 V (SPKVDD ≥ AVDD)
  • 5-mm × 5-mm 32-VQFN Package
  • Stereo Audio DAC with 95-dB SNR
  • Supports 8-kHz to 192-kHz Sample Rates
  • Mono Class-D BTL Speaker Driver (2.5 W Into 4-Ω or 1.6 W Into 8-Ω)
  • Two Single-Ended Inputs With Mixing and Output Level Control
  • Stereo Headphone/Lineout and Mono Class-D Speaker Outputs Available
  • Microphone Bias
  • Headphone Detection
  • 25 Built-in Digital Audio Processing Blocks (PRB_P1 – PRB_P25) Providing Biquad and FIR Filters, DRC, and 3-D Structures
  • Digital Mixing Capability
  • Pin Control or Register Control for Digital-Playback Volume-Control Settings
  • Digital Sine-Wave Generator for Beeps and Key Clicks (PRB_P25)
  • Programmable PLL for Flexible Clock Generation
  • I2S, Left-Justified, Right-Justified, DSP, and TDM Audio Interfaces
  • I2C Control With Register Auto-Increment
  • Full Power-Down Control
  • Power Supplies:
    • Analog: 2.7 V–3.6 V
    • Digital Core: 1.65 V–1.95 V
    • Digital I/O: 1.1 V–3.6 V
    • Class-D: 2.7 V–5.5 V (SPKVDD ≥ AVDD)
  • 5-mm × 5-mm 32-VQFN Package

The TLV320DAC3100 device is a low-power, highly integrated, high-performance stereo audio DAC with 24-bit stereo playback and digital audio processing blocks.

The device integrates headphone drivers and speaker drivers. The mono speaker driver can drive loads down to 4 Ω. The TLV320DAC3100 device has a suite of built-in processing blocks for digital audio processing. The digital audio data format is programmable to work with popular audio standard protocols (I2S, left/right-justified) in master, slave, DSP, and TDM modes. Bass boost, treble, or EQ can be supported by the programmable digital signal-processing block. An on-chip PLL provides the high-speed clock needed by the digital signal-processing block. The volume level can be controlled either by pin control or by register control. The audio functions are controlled using the I2C serial bus.

The TLV320DAC3100 device has a programmable digital sine-wave generator and is available in a 32-pin VQFN package.

The TLV320DAC3100 device is a low-power, highly integrated, high-performance stereo audio DAC with 24-bit stereo playback and digital audio processing blocks.

The device integrates headphone drivers and speaker drivers. The mono speaker driver can drive loads down to 4 Ω. The TLV320DAC3100 device has a suite of built-in processing blocks for digital audio processing. The digital audio data format is programmable to work with popular audio standard protocols (I2S, left/right-justified) in master, slave, DSP, and TDM modes. Bass boost, treble, or EQ can be supported by the programmable digital signal-processing block. An on-chip PLL provides the high-speed clock needed by the digital signal-processing block. The volume level can be controlled either by pin control or by register control. The audio functions are controlled using the I2C serial bus.

The TLV320DAC3100 device has a programmable digital sine-wave generator and is available in a 32-pin VQFN package.

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類型 標題 下載最新的英語版本 日期
* 數據表 TLV320DAC3100 Low-Power Stereo Audio DAC With Audio Processing and Mono Class-D Speaker Amplifier 數據表 (Rev. C) PDF | HTML 2017年 1月 24日
應用手冊 Audio Serial Interface Configurations for Audio Codecs (Rev. A) 2019年 6月 27日
應用手冊 PLL and Clocking Configuration for Audio Devices PDF | HTML 2019年 3月 26日
應用手冊 TLV320AIC31xx and TLV320DAC31xx Power Consumption Characterization (Rev. B) 2014年 9月 3日
應用手冊 TLV320DAC3100 Open Load Detection Test (Rev. B) 2013年 7月 27日
應用手冊 TLV320DAC3100 Open Load Detection Test (Rev. A) 2013年 4月 26日
應用手冊 Coefficient RAM Access Mechanisms.. (Rev. D) 2012年 1月 25日
應用手冊 Audio Serial Interface Configurations for Audio Codecs 2010年 9月 22日
應用手冊 Interfacing an I2S Device to an MSP430 Device (Rev. A) 2010年 3月 22日
EVM 用戶指南 ACEV-1A EVM User's Guide 2009年 12月 17日

設計和開發

如需其他信息或資源,請點擊以下任一標題進入詳情頁面查看(如有)。

評估板

TLV320DAC3100EVM-U — TLV320DAC3100EVM-U 評估模塊

TLV320DAC3100EVM-U (ACEV-1A) 是 TLV320DAC3100 音頻編解碼器的完整評估模塊。

TI 的 CodecControl 軟件支持該 EVM,該軟件是用于 TI 音頻編解碼器且基于方框圖的圖形用戶界面。

TLV320DAC3100EVM-U 連接至 PC 的 USB 端口。USB 接口為 EVM 提供電源、控制及流式音頻數據。該 EVM 具有用于外部控制信號及數字音頻數據的連接,用于高級操作。

用戶指南: PDF
TI.com 上無現貨
驅動程序或庫

TLV320DAC31XX-DRIVERS — TLV320DAC31XX DAC 系列 Linux 驅動程序支持

這些 Linux 驅動程序支持用于 TLV320DAC31xx 器件系列的低功耗音頻數模轉換器 (DAC),并且包括 .c 和 .h 文件。點擊下方的“Go to third party”按鈕將轉到 git.kernal.org,您可從中下載相應的驅動程序。

Linux 主線狀態
Linux 主線中提供:是
可通過 git.ti.com 獲取:不適用

其他文件:
(...)
仿真模型

TLV320DAC3100 IBIS Model

SLAM190.ZIP (51 KB) - IBIS Model
模擬工具

PSPICE-FOR-TI — PSpice? for TI 設計和仿真工具

PSpice? for TI 可提供幫助評估模擬電路功能的設計和仿真環境。此功能齊全的設計和仿真套件使用 Cadence? 的模擬分析引擎。PSpice for TI 可免費使用,包括業內超大的模型庫之一,涵蓋我們的模擬和電源產品系列以及精選的模擬行為模型。

借助?PSpice for TI 的設計和仿真環境及其內置的模型庫,您可對復雜的混合信號設計進行仿真。創建完整的終端設備設計和原型解決方案,然后再進行布局和制造,可縮短產品上市時間并降低開發成本。?

在?PSpice for TI 設計和仿真工具中,您可以搜索 TI (...)
封裝 引腳 CAD 符號、封裝和 3D 模型
VQFN (RHB) 32 Ultra Librarian

訂購和質量

包含信息:
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息:
  • 制造廠地點
  • 封裝廠地點

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