產品詳情

Number of channels 8 Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 150 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (μA) 5000 Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 8 Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 150 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (μA) 5000 Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SOIC (DW) 20 131.84 mm2 12.8 x 10.3 SOP (NS) 20 98.28 mm2 12.6 x 7.8 SSOP (DB) 20 56.16 mm2 7.2 x 7.8 TSSOP (PW) 20 41.6 mm2 6.5 x 6.4
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Typical VOLP (Output Ground Bounce)
        <0.8 V at VCC = 3.3 V, TA = 25°C
  • Support Unregulated Battery Operation Down to 2.7 V
  • Buffered Clock and Direct-Clear Inputs
  • Individual Data Input to Each Flip-Flop
  • Ioff Supports Partial-Power-Down-Mode Operation
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Typical VOLP (Output Ground Bounce)
        <0.8 V at VCC = 3.3 V, TA = 25°C
  • Support Unregulated Battery Operation Down to 2.7 V
  • Buffered Clock and Direct-Clear Inputs
  • Individual Data Input to Each Flip-Flop
  • Ioff Supports Partial-Power-Down-Mode Operation
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

These octal D-type flip-flops are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The ’LVTH273 devices are positive-edge-triggered flip-flops with a direct-clear input. Information at the data (D) inputs meeting the setup-time requirements is transferred to the Q outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When the clock (CLK) input is at either the high or low level, the D-input signal has no effect at the output.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down.

These octal D-type flip-flops are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The ’LVTH273 devices are positive-edge-triggered flip-flops with a direct-clear input. Information at the data (D) inputs meeting the setup-time requirements is transferred to the Q outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When the clock (CLK) input is at either the high or low level, the D-input signal has no effect at the output.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down.
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類型 標題 下載最新的英語版本 日期
* 數據表 SN54LVTH273, SN74LVTH273 數據表 (Rev. M) 2003年 10月 13日
應用手冊 慢速或浮點 CMOS 輸入的影響 (Rev. E) PDF | HTML 英語版 (Rev.E) 2025年 3月 26日
應用手冊 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
應用手冊 An Overview of Bus-Hold Circuit and the Applications (Rev. B) 2018年 9月 17日
選擇指南 Logic Guide (Rev. AB) 2017年 6月 12日
應用手冊 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 《高級總線接口邏輯器件選擇指南》 英語版 2010年 7月 7日
用戶指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
應用手冊 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
應用手冊 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
應用手冊 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002年 5月 22日
應用手冊 Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
應用手冊 LVT-to-LVTH Conversion 1998年 12月 8日
應用手冊 LVT Family Characteristics (Rev. A) 1998年 3月 1日
應用手冊 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
應用手冊 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
應用手冊 Live Insertion 1996年 10月 1日
應用手冊 Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 1994年 6月 1日

設計和開發

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評估板

14-24-LOGIC-EVM — 采用 14 引腳至 24 引腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模塊

14-24-LOGIC-EVM 評估模塊 (EVM) 設計用于支持采用 14 引腳至 24 引腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯器件。

用戶指南: PDF | HTML
英語版 (Rev.B): PDF | HTML
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仿真模型

HSPICE Model of SN74LVTH273

SCEJ174.ZIP (103 KB) - HSpice Model
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仿真模型

SN74LVTH273 IBIS Model (Rev. B)

SCBM055B.ZIP (12 KB) - IBIS Model
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封裝 引腳 CAD 符號、封裝和 3D 模型
SOIC (DW) 20 Ultra Librarian
SOP (NS) 20 Ultra Librarian
SSOP (DB) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息：
  • 制造廠地點
  • 封裝廠地點

支持和培訓

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