產品詳情

Function RS latch Number of channels 4 Technology family LS Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type Bipolar Output type Push-Pull Data rate (max) (Mbps) 70 IOL (max) (mA) 8 IOH (max) (mA) -0.4 Features Very high speed (tpd 5-10ns) Operating temperature range (°C) 0 to 70 Rating Catalog
Function RS latch Number of channels 4 Technology family LS Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type Bipolar Output type Push-Pull Data rate (max) (Mbps) 70 IOL (max) (mA) 8 IOH (max) (mA) -0.4 Features Very high speed (tpd 5-10ns) Operating temperature range (°C) 0 to 70 Rating Catalog
PDIP (N) 16 181.42 mm2 19.3 x 9.4 SOIC (D) 16 59.4 mm2 9.9 x 6 SOP (NS) 16 79.56 mm2 10.2 x 7.8
  • Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability
  • Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability

The ’279 offers 4 basic S\-R\ flip-flop latches in one 16-pin, 300-mil package. Under conventional operation, the S\-R\ inputs are normally held high. When the S\ input is pulsed low, the Q output will be set high. When R\ is pulsed low, the Q output will be reset low. Normally, the S\-R\ inputs should not be taken low simultaneously. The Q output will be unpredictable in this condition.

The ’279 offers 4 basic S\-R\ flip-flop latches in one 16-pin, 300-mil package. Under conventional operation, the S\-R\ inputs are normally held high. When the S\ input is pulsed low, the Q output will be set high. When R\ is pulsed low, the Q output will be reset low. Normally, the S\-R\ inputs should not be taken low simultaneously. The Q output will be unpredictable in this condition.
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類型 標題 下載最新的英語版本 日期
* 數據表 Quadruple S-R Latches 數據表 1988年 3月 1日

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息：
  • 制造廠地點
  • 封裝廠地點

支持和培訓