SN74AUP2G79

正在供貨

低功耗雙通道正邊沿觸發(fā)式 D 型觸發(fā)器

產(chǎn)品詳情

Number of channels 2 Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 260 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (μA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 2 Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 260 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (μA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
UQFN (RSE) 8 2.25 mm2 1.5 x 1.5 VSSOP (DCU) 8 6.2 mm2 2 x 3.1 X2SON (DQE) 8 1.4 mm2 1.4 x 1
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption
    (ICC = 0.9 μA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

NanoStar is a trademark of Texas Instruments.
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption
    (ICC = 0.9 μA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

NanoStar is a trademark of Texas Instruments.

The AUP family is TI’s premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see ). This product also maintains excellent signal integrity.

When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The AUP family is TI’s premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see ). This product also maintains excellent signal integrity.

When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
下載 觀看帶字幕的視頻 視頻

您可能感興趣的相似產(chǎn)品

功能與比較器件相同，且具有相同引腳
SN74LVC74A 正在供貨 具有清零和預設功能的雙通道上升沿觸發(fā) D 類觸發(fā)器 Larger voltage range (1.65V to 5.5V), higher drive average drive strength (24mA)
功能與比較器件相似
SN74LVC2G79 正在供貨 雙通道上升沿 D 類觸發(fā)器 Larger voltage range (1.65V to 5.5V), higher drive average drive strength (24mA)

技術文檔

star =有關此產(chǎn)品的 TI 精選熱門文檔
未找到結果。請清除搜索并重試。
查看全部 10
類型 標題 下載最新的英語版本 日期
* 數(shù)據(jù)表 SN74AUP2G79 Low-Power Dual Positive-Edge-Triggered D-Type Flip-Flop 數(shù)據(jù)表 (Rev. C) 2012年 7月 30日
應用簡報 了解施密特觸發(fā)器 (Rev. B) PDF | HTML 英語版 (Rev.B) PDF | HTML 2025年 5月 5日
應用手冊 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
選擇指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
選擇指南 Logic Guide (Rev. AB) 2017年 6月 12日
應用手冊 How to Select Little Logic (Rev. A) 2016年 7月 26日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 小尺寸邏輯器件指南 (Rev. E) 最新英語版本 (Rev.G) 2012年 7月 16日
應用手冊 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 1994年 6月 1日

設計和開發(fā)

如需其他信息或資源，請點擊以下任一標題進入詳情頁面查看（如有）。

評估板

5-8-LOGIC-EVM — 支持 5 至 8 引腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模塊

靈活的 EVM 設計用于支持具有 5 至 8 引腳數(shù)且采用 DCK、DCT、DCU、DRL 或 DBV 封裝的任何器件。
用戶指南: PDF
TI.com 上無現(xiàn)貨
封裝 引腳 CAD 符號、封裝和 3D 模型
UQFN (RSE) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian
X2SON (DQE) 8 Ultra Librarian

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息：
  • 制造廠地點
  • 封裝廠地點

支持和培訓

視頻