主頁 接口 LVDS、M-LVDS 和 PECL IC

SN65LVDT14-EP

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增強(qiáng)型產(chǎn)品 Memorystick? 內(nèi)部互聯(lián)擴(kuò)展器芯片組

產(chǎn)品詳情

Function Transceiver Protocols LVDS Number of transmitters 1 Number of receivers 4 Supply voltage (V) 3.3 Signaling rate (Mbps) 125 Input signal LVDS, LVTTL Output signal LVDS, LVTTL Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
Function Transceiver Protocols LVDS Number of transmitters 1 Number of receivers 4 Supply voltage (V) 3.3 Signaling rate (Mbps) 125 Input signal LVDS, LVTTL Output signal LVDS, LVTTL Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
TSSOP (PW) 20 41.6 mm2 6.5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Integrated 110- Nominal Receiver Line Termination Resistor
  • Operate From a Single 3.3-V Supply
  • Greater Than 125-Mbps Data Rate
  • Flow-Through Pinout
  • LVTTL-Compatible Logic I/Os
  • ESD Protection on Bus Pins Exceeds 12 kV
  • Meet or Exceed Requirements of ANSI/TIA/EIA-644A Standard for LVDS
  • 20-Pin Thin Shrink Small-Outline Package (PW) With 26-Mil Terminal Pitch
  • APPLICATIONS
    • Memory Stick? Interface Extensions With Long Interconnects Between Host and
      Memory Stick
    • Serial Peripheral Interface? (SPI?) Interface Extension to Allow Long Interconnects
      Between Master and Slave
    • MultiMediaCard? (MMC) Interface in SPI Mode
    • General-Purpose Asymmetric Bidirectional Communication

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
Serial Peripheral Interface, SPI are trademarks of Motorola.
MultiMediaCard is a trademark of MultiMediaCard Association.
Memory Stick is a trademark of Sony.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Integrated 110- Nominal Receiver Line Termination Resistor
  • Operate From a Single 3.3-V Supply
  • Greater Than 125-Mbps Data Rate
  • Flow-Through Pinout
  • LVTTL-Compatible Logic I/Os
  • ESD Protection on Bus Pins Exceeds 12 kV
  • Meet or Exceed Requirements of ANSI/TIA/EIA-644A Standard for LVDS
  • 20-Pin Thin Shrink Small-Outline Package (PW) With 26-Mil Terminal Pitch
  • APPLICATIONS
    • Memory Stick? Interface Extensions With Long Interconnects Between Host and
      Memory Stick
    • Serial Peripheral Interface? (SPI?) Interface Extension to Allow Long Interconnects
      Between Master and Slave
    • MultiMediaCard? (MMC) Interface in SPI Mode
    • General-Purpose Asymmetric Bidirectional Communication

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
Serial Peripheral Interface, SPI are trademarks of Motorola.
MultiMediaCard is a trademark of MultiMediaCard Association.
Memory Stick is a trademark of Sony.

The SN65LVDT14 combines one LVDS line driver with four terminated LVDS line receivers in one package. It is designed to be used at the Memory Stick™ end of an LVDS-based Memory Stick interface extension.

The SN65LVDT41 combines four LVDS line drivers with a single terminated LVDS line receiver in one package. It is designed to be used at the host end of an LVDS-based Memory Stick interface extension.

The SN65LVDT14 combines one LVDS line driver with four terminated LVDS line receivers in one package. It is designed to be used at the Memory Stick™ end of an LVDS-based Memory Stick interface extension.

The SN65LVDT41 combines four LVDS line drivers with a single terminated LVDS line receiver in one package. It is designed to be used at the host end of an LVDS-based Memory Stick interface extension.

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類型 標(biāo)題 下載最新的英語版本 日期
* 數(shù)據(jù)表 SN65LVDT14-EP, SN65LVDT41-EP 數(shù)據(jù)表 2005年 6月 7日
* VID SN65LVDT14-EP VID V6205615 2016年 6月 21日
* VID SN65LVDT14-EP VID V6205615 2016年 6月 21日
應(yīng)用簡報 LVDS to Improve EMC in Motor Drives 2018年 9月 27日
應(yīng)用簡報 How Far, How Fast Can You Operate LVDS Drivers and Receivers? 2018年 8月 3日
應(yīng)用簡報 How to Terminate LVDS Connections with DC and AC Coupling 2018年 5月 16日

設(shè)計和開發(fā)

如需其他信息或資源,請點擊以下任一標(biāo)題進(jìn)入詳情頁面查看(如有)。

仿真模型

SN65LVDT14 IBIS Model

SLLC119.ZIP (7 KB) - IBIS Model
模擬工具

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PSpice? for TI 可提供幫助評估模擬電路功能的設(shè)計和仿真環(huán)境。此功能齊全的設(shè)計和仿真套件使用 Cadence? 的模擬分析引擎。PSpice for TI 可免費使用,包括業(yè)內(nèi)超大的模型庫之一,涵蓋我們的模擬和電源產(chǎn)品系列以及精選的模擬行為模型。

借助?PSpice for TI 的設(shè)計和仿真環(huán)境及其內(nèi)置的模型庫,您可對復(fù)雜的混合信號設(shè)計進(jìn)行仿真。創(chuàng)建完整的終端設(shè)備設(shè)計和原型解決方案,然后再進(jìn)行布局和制造,可縮短產(chǎn)品上市時間并降低開發(fā)成本。?

在?PSpice for TI 設(shè)計和仿真工具中,您可以搜索 TI (...)
模擬工具

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TINA-TI 提供了 SPICE 所有的傳統(tǒng)直流、瞬態(tài)和頻域分析以及更多。TINA 具有廣泛的后處理功能,允許您按照希望的方式設(shè)置結(jié)果的格式。虛擬儀器允許您選擇輸入波形、探針電路節(jié)點電壓和波形。TINA 的原理圖捕獲非常直觀 - 真正的“快速入門”。

TINA-TI 安裝需要大約 500MB。直接安裝,如果想卸載也很容易。我們相信您肯定會愛不釋手。

TINA 是德州儀器 (TI) 專有的 DesignSoft 產(chǎn)品。該免費版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。

如需獲取可用 TINA-TI 模型的完整列表,請參閱:SpiceRack - 完整列表 

需要 HSpice (...)

用戶指南: PDF
英語版 (Rev.A): PDF
封裝 引腳 CAD 符號、封裝和 3D 模型
TSSOP (PW) 20 Ultra Librarian

訂購和質(zhì)量

包含信息:
  • RoHS
  • REACH
  • 器件標(biāo)識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息:
  • 制造廠地點
  • 封裝廠地點

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