產品詳情

Sample rate (max) (Msps) 1600, 3200 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2400 Features Ultra High Speed Rating Space Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3880 Architecture Folding Interpolating SNR (dB) 58.2 ENOB (Bits) 9.3 SFDR (dB) 67.3 Operating temperature range (°C) -55 to 125 Input buffer Yes Radiation, TID (typ) (krad) 300 Radiation, SEL (MeV·cm2/mg) 120
Sample rate (max) (Msps) 1600, 3200 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2400 Features Ultra High Speed Rating Space Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3880 Architecture Folding Interpolating SNR (dB) 58.2 ENOB (Bits) 9.3 SFDR (dB) 67.3 Operating temperature range (°C) -55 to 125 Input buffer Yes Radiation, TID (typ) (krad) 300 Radiation, SEL (MeV·cm2/mg) 120
CCGA (NAA) 376 780.6436 mm2 27.94 x 27.94
  • Total Ionizing Dose (TID) to 300 krad(Si)
  • Single Event Latch-up (SEL) > 120 MeV-cm2/mg
  • Wide Temperature Range –55°C to +125°C
  • Low Power Consumption
  • R/W SPI for Extended Control Mode or Simple Pin Control Mode
  • Interleaved Timing Automatic with Manual Skew Adjust
  • Auto-Sync Function for Multi-Chip Systems
  • Time Stamp Feature to Capture External Trigger
  • Test Patterns at Output for System Debug
  • 1:1 Non-Demuxed or 1:2 or 1:4 Parallel Demuxed LVDS Outputs
  • Single 1.9V Power Supply
  • 376 CPGA Hermetic Package
  • Total Ionizing Dose (TID) to 300 krad(Si)
  • Single Event Latch-up (SEL) > 120 MeV-cm2/mg
  • Wide Temperature Range –55°C to +125°C
  • Low Power Consumption
  • R/W SPI for Extended Control Mode or Simple Pin Control Mode
  • Interleaved Timing Automatic with Manual Skew Adjust
  • Auto-Sync Function for Multi-Chip Systems
  • Time Stamp Feature to Capture External Trigger
  • Test Patterns at Output for System Debug
  • 1:1 Non-Demuxed or 1:2 or 1:4 Parallel Demuxed LVDS Outputs
  • Single 1.9V Power Supply
  • 376 CPGA Hermetic Package

The ADC12D1600QML is a low power, high performance CMOS analog-to-digital converter that digitizes signals at a 12-bit resolution at sampling rates up to 3.2 GSPS in an interleaved mode. It can also be used as a dual channel ADC for sampling rates up to 1.6 GSPS. For sampling rates below 800 MHz, there is a Low Sampling Power Saving Mode (LSPSM) that reduces power consumption to less than 1.4 W per channel (typical). The ADC can support conversion rates as low as 200 MSPS.

The ADC1600QML provides a flexible parallel LVDS interface which has multiple SPI programmable options to facilitate board design and ASIC/FPGA data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and support programmable common mode voltage. The output of each channel is configurable in either 1:1 non-demuxed or 1:2 demuxed modes. If used as a single channel ADC, there is an option for 1:4 demuxing of the output. The product comes in a hermetic 376 CPGA package for harsh environments.

The ADC12D1600QML is a low power, high performance CMOS analog-to-digital converter that digitizes signals at a 12-bit resolution at sampling rates up to 3.2 GSPS in an interleaved mode. It can also be used as a dual channel ADC for sampling rates up to 1.6 GSPS. For sampling rates below 800 MHz, there is a Low Sampling Power Saving Mode (LSPSM) that reduces power consumption to less than 1.4 W per channel (typical). The ADC can support conversion rates as low as 200 MSPS.

The ADC1600QML provides a flexible parallel LVDS interface which has multiple SPI programmable options to facilitate board design and ASIC/FPGA data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and support programmable common mode voltage. The output of each channel is configurable in either 1:1 non-demuxed or 1:2 demuxed modes. If used as a single channel ADC, there is an option for 1:4 demuxing of the output. The product comes in a hermetic 376 CPGA package for harsh environments.
下載 觀看帶字幕的視頻 視頻

技術文檔

star =有關此產品的 TI 精選熱門文檔
未找到結果。請清除搜索并重試。
查看全部 18
類型 標題 下載最新的英語版本 日期
* 數(shù)據(jù)表 ADC12D1600QML 12-Bit, 3.2/2.0 GSPS RF Sampling ADC 數(shù)據(jù)表 2012年 12月 17日
* 輻射與可靠性報告 ADC12D1600QML-SP/ADC12D1620QML-SP Single-Event Effects (SEE) Radiation Report 2020年 7月 27日
* 輻射與可靠性報告 Single Event Effects Characterization of Texas Instruments ADC12D1600CCMLS 2018年 6月 14日
* 輻射與可靠性報告 ADC12D1600CCMLS TID Report 2013年 1月 17日
* 輻射與可靠性報告 Analysis of Low Dose Rate Effects on Parasitic Bipolar Structures in CMOS Proces 2012年 5月 4日
應用簡報 經(jīng) DLA 批準的 QML 產品優(yōu)化 (Rev. C) PDF | HTML 英語版 (Rev.C) PDF | HTML 2025年 8月 18日
應用手冊 重離子軌道環(huán)境單粒子效應估算 (Rev. B) PDF | HTML 英語版 (Rev.B) PDF | HTML 2025年 7月 7日
選擇指南 TI Space Products (Rev. K) 2025年 4月 4日
更多文獻資料 TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. B) 2025年 2月 20日
應用手冊 單粒子效應置信區(qū)間計算 (Rev. A) PDF | HTML 英語版 (Rev.A) PDF | HTML 2022年 12月 2日
應用簡報 了解音頻電路中的運算放大器噪聲 PDF | HTML 英語版 PDF | HTML 2022年 11月 14日
應用手冊 AN-2132 Synchronizing Multiple GSPS ADCs in a System: The AutoSync Feature (Rev. G) 2017年 2月 3日
應用手冊 Wide Bandwidth Receiver Implementation by Interleaving Two Giga-Sampling ADCs 2015年 12月 7日
應用手冊 Signal Chain Noise Figure Analysis 2014年 10月 29日
應用手冊 Synchronizing the Giga-Sample ADCs Interfaced with Multiple FPGAs 2014年 8月 6日
應用手冊 AN-2128 ADC1xD1x00 Pin Compatibility (Rev. C) 2013年 5月 1日
應用手冊 From Sample Instant to Data Output: Understanding Latency in the GSPS ADC 2012年 12月 18日
產品概述 ADC12Dxx00RF Direct RF-Sampling ADC Family 2012年 5月 16日

設計和開發(fā)

如需其他信息或資源，請點擊以下任一標題進入詳情頁面查看（如有）。

仿真模型

ADC12D1600 IBIS Model (Rev. A)

SNAM125A.ZIP (43 KB) - IBIS Model
下載
模擬工具

PSPICE-FOR-TI — PSpice? for TI 設計和仿真工具

PSpice? for TI 可提供幫助評估模擬電路功能的設計和仿真環(huán)境。此功能齊全的設計和仿真套件使用 Cadence? 的模擬分析引擎。PSpice for TI 可免費使用，包括業(yè)內超大的模型庫之一，涵蓋我們的模擬和電源產品系列以及精選的模擬行為模型。

借助?PSpice for TI 的設計和仿真環(huán)境及其內置的模型庫，您可對復雜的混合信號設計進行仿真。創(chuàng)建完整的終端設備設計和原型解決方案，然后再進行布局和制造，可縮短產品上市時間并降低開發(fā)成本。?

在?PSpice for TI 設計和仿真工具中，您可以搜索 TI (...)
發(fā)送申請
封裝 引腳 CAD 符號、封裝和 3D 模型
CCGA (NAA) 376 Ultra Librarian

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息：
  • 制造廠地點
  • 封裝廠地點

推薦產品可能包含與 TI 此產品相關的參數(shù)、評估模塊或參考設計。

支持和培訓

視頻