The QFN package of TPS629xx-Q1 is half the size of the previous generation, however the size of the package is not the only thing that has shrunk. The total solution size is reduced by 20% of the TPS621x0A-Q1 when compared on their EVMs, with the reduction limited by larger automotive grade capacitors used on the TPS629xx-Q1 versus the standard TPS6290x. To achieve both of these reductions, TPS629xx-Q1 has decreased the number of pins on the package from 16 to 9, allowing the package to shrink and decreasing the passives needed to configure the device. The result saves precious board space, BOM costs and design time.