SFFSAD6A April 2025 – September 2025 TPSM33606-Q1 , TPSM33610-Q1 , TPSM33620-Q1
1 Overview
This document contains information for the TPSM336xx-Q1 (QFN-HR package) to aid in a functional safety system design. Information provided are:
- Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
- Component failure modes and distribution (FMD) based on the primary function of the device
- Pin failure mode analysis (pin FMA)
Figure 1-1 shows the device functional block diagram for reference.
Figure 1-1 Functional Block
DiagramThe TPSM336xx-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.
ADVANCE INFORMATION for preproduction products; subject to change without notice.