This section provides functional safety failure in time (FIT) rates for the SOIC package of the UCC273x1A-Q1 based on two different industry-wide used reliability standards:

• Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
• Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

• Mission profile: Motor control from table 11
• Power dissipation: 10mW, 400mW
• Climate type: World-wide table 8
• Package factor (lambda 3): Table 17b
• Substrate material: FR4
• EOS FIT rate assumed: 0 FIT

The reference FIT rate and reference virtual T_J (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.