SFFS617 September 2025 TPS281C30

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TPS281C30x. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-2)
Pin open-circuited (see Table 4-3)
Pin short-circuited to an adjacent pin (see Table 4-4)
Pin short-circuited to VS supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality.
B	No device damage, but loss of functionality.
C	No device damage, but performance degradation.
D	No device damage, no impact to functionality or performance.

Figure 4-1 shows the TPS281C30x pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TPS281C30x data sheet.

Figure 4-1 Pin Diagram for RGW (QFN, 20)

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

The device pins are connected per the recommendation in the data sheet, including pullup and pulldown resistors, as needed.
The data sheet recommendations for operating conditions, external component selection, and PCB layout are followed.

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground

Pin Name	Pin No.	Description of Potential Failure Effects	Failure Effect Class
ILIM	1	The current limit is set at a low level, as per the data sheet.	C
NC	2	No effect.	D
	7
	8
	9
	14
VOUT	3	The current limit of the device engages, and thermal protection turns off the FET.	B
	4
	5
	6
VS	10	The output stages are not powered, and the FET does not turn ON.	B
	11
	12
	13
EN	15	The main FET is turned off.	B
DIAG_EN	16	Diagnostics features do not function, including current sense and fault reporting.	B
FAULT	17	The reported fault status is potentially erroneous.	B
GND	18	Any GND network, connected for protection, is bypassed.	B
OL_ON	19	High-accuracy current sense is not available.	B
SNS	20	The reported SNS current or fault status on the SNS pin is erroneous.	B

Table 4-3 Pin FMA for Device Pins Open-Circuited

Pin Name	Pin No.	Description of Potential Failure Effects	Failure Effect Class
ILIM	1	The current limit is set at a low level, as per the data sheet.	C
NC	2	No effect.	D
	7
	8
	9
	14
VOUT	3	During the ON state of the device, if any one pin is open, the switch resistance increases. During the OFF state of the device, if the DIAG_EN pin is high, an open-load fault reports.	B
	4
	5
	6
VS	10	During the ON state of the device, if any one pin is open, the switch resistance increases. If all pins are open, the device is not powered and the switch is kept OFF.	B
	11
	12
	13
EN	15	The main FET is turned off.	B
DIAG_EN	16	Diagnostics features do not function, including ON state current sense, OFF state open-load, and short-to-battery.	B
FAULT	17	The fault condition is not reported.	B
GND	18	The loss of ground detection engages, and the device turns OFF.	B
OL_ON	19	High-accuracy current sense is not available.	B
SNS	20	The current sense voltage of the pin is clamped internally and no current sense information is available.	B

Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin

Pin Name	Pin No.	Shorted to	Description of Potential Failure Effects	Failure Effect Class
ILIM	1	NC	No effect.	D
NC	2	VOUT	No effect.	D
VOUT	3	N/A	Not plausible (corner pin).	D
	4
	5
VOUT	6	NC	No effect.	D
NC	7	VS	No effect.	D
	8
	9
VS	10	N/A	Not plausible (corner pin).	D
VS	11	NC	No effect.	D
	12
	13
NC	14	EN	No effect.	D
EN	15	N/A	Not plausible (corner pin).	D
DIAG_EN	16	FAULT	Fault reporting is erroneous. Diagnostics are enabled if the FAULT pin is pulled high.	B
FAULT	17	GND	The reported fault status is potentially erroneous.	B
GND	18	OL_ON	High-accuracy current sense is not available.	B
OL_ON	19	SNS	The current sensing output is potentially erroneous, and effects the high-accuracy current sense.	B
SNS	20	N/A	Not plausible (corner pin).	D

Table 4-5 Pin FMA for Device Pins Short-Circuited to VS Supply

Pin Name	Pin No.	Description of Potential Failure Effects	Failure Effect Class
ILIM	1	There is a potential violation of the absolute maximum rating for the pin and a possible breakdown of the ESD cell.	A
NC	2	No effect.	D
	7
	8
	9
	14
VOUT	3	The output is pulled to supply voltage. A short-to-battery detection triggers during the OFF state if the DIAG_EN pin is high.	B
	4
	5
	6
VS	10	No effect.	D
	11
	12
	13
EN	15	There is a potential violation of the absolute maximum rating for the pin and a possible breakdown of the ESD cell.	A
DIAG_EN	16	There is a potential violation of the absolute maximum rating for the pin and a possible breakdown of the ESD cell.	A
FAULT	17	There is a potential violation of the absolute maximum rating for the pin and a possible breakdown of the ESD cell.	A
GND	18	The supply power is bypassed, and the device stays OFF.	B
OL_ON	19	There is a potential violation of the absolute maximum rating for the pin and a possible breakdown of the ESD cell.	A
SNS	20	There is a potential violation of the absolute maximum rating for the pin and a possible breakdown of the ESD cell.	A