1 Overview

This document contains information for the following device and package combinations to aid in a functional safety system design:

• UCC27200-Q1, UCC27201A-Q1, UCC27211A-Q1, and UCC27212A-Q1 (SOIC PowerPAD? integrated circuit package)
• UCC27211A-Q1 (SOIC package)

Information provided are:

• Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
• Component failure modes and distribution (FMD) based on the primary function of the device
• Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram

UCC27200-Q1, UCC2720xA-Q1, and UCC2721xA-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.