SFFS191C March 2022 – November 2025 UCC27200-Q1 , UCC27201A-Q1 , UCC27211A-Q1 , UCC27212A-Q1
This section provides functional safety failure in time (FIT) rates for UCC27211A-Q1 (SOIC) based on two different industry-wide used reliability standards:
| FIT IEC TR 62380 / ISO 26262 | Power Dissipation (mW) | FIT (Failures Per 109 Hours) |
|---|---|---|
| Total component FIT rate | 50 | 10 |
| 200 | 13 | |
| Die FIT rate | 50 | 3 |
| 200 | 5 | |
| Package FIT rate | 50 | 7 |
| 200 | 8 |
The failure rate and mission profile information in Table 2-3 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
| Table | Category | Reference FIT Rate | Reference Virtual TJ |
|---|---|---|---|
| 5 | CMOS,
BICMOS Digital, analog, or mixed |
20 | 55 |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.