SBOA412 August 2020 TLV314-Q1
This section provides a Failure Mode Analysis (FMA) for the pins of the TLV314-Q1 (SC70-5 and SOT-23 package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Pin FMA for Device Pins Short-Circuited to Ground through Pin FMA for Device Pins Short-Circuited to Supply also indicate how these pin conditions can affect the device as per the failure effects classification in TI Classification of Failure Effects.
| Class | Failure Effects |
|---|---|
| A | Potential device damage that affects functionality |
| B | No device damage, but loss of functionality |
| C | No device damage, but performance degradation |
| D | No device damage, no impact to functionality or performance |
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section: