ZHCSHO6 February 2018 XTR305
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics: Voltage Output Mode
- 6.6 Electrical Characteristics: Current Output Mode
- 6.7 Electrical Characteristics: Operational Amplifier (OPA)
- 6.8 Electrical Characteristics: Instrumentation Amplifier (IA)
- 6.9 Electrical Characteristics: Current Monitor
- 6.10 Electrical Characteristics: Power and Digital
- 6.11 Typical Characteristics
- 7 Detailed Description
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Voltage Output Mode
- 8.2.2.2 Current Output Mode
- 8.2.2.3 Input Signal Connection
- 8.2.2.4 Externally-Configured Mode: OPA and IA
- 8.2.2.5 Driver Output Disable
- 8.2.2.6 Driving Capacitive Loads and Loop Compensation
- 8.2.2.7 Internal Current Sources, Switching Noise, and Settling Time
- 8.2.2.8 IA Structure, Voltage Monitor
- 8.2.2.9 Digital I/O and Ground Considerations
- 8.2.2.10 Output Protection
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RGW|20
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RGW|20
訂購信息
11.5 靜電放電警告
ESD 可能會(huì)損壞該集成電路。德州儀器 (TI) 建議通過適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理措施和安裝程序 , 可能會(huì)損壞集成電路。
ESD 的損壞小至導(dǎo)致微小的性能降級(jí) , 大至整個(gè)器件故障。 精密的集成電路可能更容易受到損壞 , 這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。