ZHCSQ75C June 2022 – March 2023 UCC28C50-Q1 , UCC28C51-Q1 , UCC28C52-Q1 , UCC28C53-Q1 , UCC28C54-Q1 , UCC28C55-Q1 , UCC28C56H-Q1 , UCC28C56L-Q1 , UCC28C57H-Q1 , UCC28C57L-Q1 , UCC28C58-Q1 , UCC28C59-Q1
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Primary-to-Secondary Turns Ratio of the Flyback Transformer (NPS)
- 9.2.2.2 Primary Magnetizing Inductance of the Flyback Transformer (LM)
- 9.2.2.3 Number of Turns of the Flyback Transformer Windings
- 9.2.2.4 Current Sense Resistors (R24, R25) and Current Limiting
- 9.2.2.5 Primary Clamp Circuit (D7, D1, D3, R2, R28) to Limit Voltage Stress
- 9.2.2.6 Primary-Side Current Stress and Input Capacitor Selection
- 9.2.2.7 Secondary-Side Current Stress and Output Capacitor Selection
- 9.2.2.8 VDD Capacitors (C12, C18)
- 9.2.2.9 Gate Drive Network (R14, R16, Q6)
- 9.2.2.10 VREF Capacitor (C18)
- 9.2.2.11 RT/CT Components (R12, C15)
- 9.2.2.12 HV Start-Up Circuitry for VDD (Q1, Q2, D2, D4, D6, D8, R5)
- 9.2.2.13 Desensitization to CS-pin Noise by RC Filtering, Leading-Edge Blanking, and Slope Compensation
- 9.2.2.14 Voltage Feedback Compensation
- 9.2.3 Application Curves
- 9.3 PCB Layout Recommendations
- 9.4 Power Supply Recommendations
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- D|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
10.6 靜電放電警告
 |
靜電放電 (ESD) 會(huì)損壞這個(gè)集成電路。德州儀器 (TI) 建議通過適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會(huì)損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級(jí)，大至整個(gè)器件故障。精密的集成電路可能更容易受到損壞，這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |