SLUSF25 September 2025 UCC27834
PRODMIX
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | UCC278X4 | UNIT | |
|---|---|---|---|
| (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 114.0 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 54.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 62.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 61.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |