ZHCSKO8C June 2021 – January 2022 UCC27614
PRODUCTION DATA
| THERMAL METRIC(1) | UCC27614 | UCC27614 | UNIT | |
|---|---|---|---|---|
| SON (DSG) | SOIC (D) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 67.9 | 126.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 81.1 | 67.0 | |
| RθJB | Junction-to-board thermal resistance | 33.4 | 69.9 | |
| ψJT | Junction-to-top characterization parameter | 2.4 | 19.2 | |
| ψJB | Junction-to-board characterization parameter |
33.4 |
69.1 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 12.2 | n/a | |