ZHCSNM5C november 2020 – august 2023 UCC25800-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UCC25800-Q1 | UNIT | |
|---|---|---|---|
| DGN (HVSSOP) | |||
| 8 PINS | |||
| RΘJA | Junction-to-ambient thermal resistance | 47.9 | °C/W |
| RΘJC(top) | Junction-to-case (top) thermal resistance | 59.1 | °C/W |
| RΘJB | Junction-to-board thermal resistance | 18.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 18.4 | °C/W |
| RΘJC(bot) | Junction-to-case (bottom) thermal resistance | 5.6 | °C/W |