ZHCSM92A January 2021 – June 2021 UCC12051-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UCC12051-Q1 | UNIT | |
|---|---|---|---|
| DVE (SOIC) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 57.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 21.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 33.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 10.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 33.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |