SCDS300E July 2010 – June 2020 TS3USB221A-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | TS3USB221A-Q1 | UNIT | |
|---|---|---|---|
| RSE (UQFN) | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 179.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 107.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 100.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 100 | °C/W |