ZHCSJR6B SEPTEMBER 2004 – October 2019 TS3L110
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TS3L110 | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D (SOIC) | DBQ (SSOP) | DGV (TVSOP) | PW (TSSOP) | RGV (VQFN) | |||
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 92.0 | 114.5 | 139.3 | 111.5 | 50.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.3 | 60.5 | 57.4 | 42.0 | 48.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 50.3 | 58.2 | 73.7 | 57.8 | 26.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 17.3 | 15.3 | 7.2 | 4.2 | 2.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 50.0 | 57.6 | 73.0 | 57.2 | 26.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | - | - | 10.7 | °C/W |