ZHCSIY9 October 2018 TS3A5017-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics for 3.3-VSupply
- 6.6 Electrical Characteristics for 2.5-VSupply
- 6.7 Switching Characteristics for 3.3-VSupply
- 6.8 Switching Characteristics for 2.5-VSupply
- 6.9 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RGY|16
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
6.9 Typical Characteristics
Figure 1. ron vs VCOM 
Figure 3. ron vs VCOM (V+ = 2.5 V) 
Figure 5. Charge Injection (QC) vs VCOM 
Figure 7. Logic-Level Threshold vs V+ 
Figure 9. OFF Isolation and Crosstalk vs Frequency
(V+ = 3.3 V)
Figure 11. Power-Supply Current vs Temperature
(V+ = 3.6 V)
Figure 2. ron vs VCOM (V+ = 3.3 V) 
Figure 4. Leakage Current vs Temperature (V+ = 3.6 V) 
Figure 6. tON and tOFF vs Supply Voltage 
Figure 8. Bandwidth (Gain vs Frequency) (V+ = 3.3 V) 
Figure 10. Total Harmonic Distortion vs Frequency