ZHCSJ92E October 2009 – September 2022 TS12A12511
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5 Pin Configuration and Functions
Figure 5-1 DGK Package, 8-Pin VSSOP (Top View)
Figure 5-2 DCN Package, 8-Pin SOT-23
(Top View)
N.C. – Not internally
connected NC – Normally closed NO – Normally open
The Exposed Thermal
Pad must be electrically connected to V– or left floating.
Figure 5-3 DRJ Package, 8-Pin WSON (Top
View)Table 5-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| COM | 1 | I/O | Common. Can be an input or output. |
| GND | 3 | — | Ground (0 V) reference |
| IN | 6 | I | Logic control input |
| NC | 2 | I/O | Normally closed. Can be an input or output. |
| N.C. | 5 | — | No connect. Not internally connected. |
| NO | 8 | I/O | Normally open. Can be an input or output. |
| VCC | 4 | I | Most positive power supply |
| –VCC | 7 | I | Most negative power supply. This pin is only used in dual-supply applications and should be tied to ground in single-supply applications. |
| Thermal pad | — | The Exposed Thermal Pad must be electrically connected to V– or left floating. | |
(1) I = input, O = output