6.4 Thermal Information
| THERMAL METRIC(1) |
LMZM33604 |
UNIT |
| RLX(B2QFN) |
| 41 PINS |
| RθJA |
Junction-to-ambient thermal resistance (2) |
13.9 |
°C/W |
| ψJT |
Junction-to-top characterization parameter (3) |
1.2 |
°C/W |
| ψJB |
Junction-to-board characterization parameter (4) |
6.2 |
°C/W |
| TSHDN |
Thermal Shutdown Temperature |
160 |
°C |
| Thermal Shutdown Hysteresis |
25 |
°C |
(1) For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report,
SPRA953.
(2) The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 75 mm x 75 mm double-sided PCB with 2 oz. copper and natural convection cooling. Additional airflow reduces RθJA.
(3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.