ZHCSIY5A October 2018 – May 2019 LMZM33604
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Adjusting the Output Voltage
- 7.3.2 Input Capacitor Selection
- 7.3.3 Output Capacitor Selection
- 7.3.4 Transient Response
- 7.3.5 Feed-Forward Capacitor
- 7.3.6 Switching Frequency (RT)
- 7.3.7 Synchronization (SYNC/MODE)
- 7.3.8 Output Enable (EN)
- 7.3.9 Programmable System UVLO (EN)
- 7.3.10 Internal LDO and BIAS_SEL
- 7.3.11 Power Good (PGOOD) and Power Good Pullup (PGOOD_PU)
- 7.3.12 Mode Select (Auto or FPWM)
- 7.3.13 Soft Start and Voltage Tracking
- 7.3.14 Voltage Dropout
- 7.3.15 Overcurrent Protection (OCP)
- 7.3.16 Thermal Shutdown
- 7.4 Device Functional Modes
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RLX|41
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
10.3 Theta JA vs PCB Area
The amount of PCB copper effects the thermal performance of the device. Figure 52 shows the effects of copper area on the junction-to-ambient thermal resistance (RθJA) of the LMZM33604. The junction-to-ambient thermal resistance is plotted for a 4-layer PCB and a 6-layer PCB with PCB area from 16 cm2 to 100 cm2.
To determine the required copper area for an application:
- Determine the maximum power dissipation of the device in the application by referencing the power dissipation graphs in the Typical Characteristics section.
- Calculate the maximum θJA using Equation 8 and the maximum ambient temperature of the application.
- Reference Figure 52 to determine the minimum required PCB area for the application conditions.
Equation 8. 
Figure 52. θJA vs PCB Area