| THERMAL METRIC(1) |
TPSM53603 |
UNIT |
| RDA (QFN) |
| 15 PINS |
| RθJA |
Junction-to-ambient thermal resistance (2) |
19.5 |
°C/W |
| ψJT |
Junction-to-top characterization parameter (3) |
1.0 |
°C/W |
| ψJB |
Junction-to-board characterization parameter (4) |
5.5 |
°C/W |
| TSHDN |
Thermal shutdown temperature |
165 |
°C |
| Recovery temperaure |
148 |
°C |
(2) The junction-to-ambient thermal resistance, R
θJA,
applies to devices soldered directly to a 75-mm x 75-mm four-layer PCB with 2
oz. copper and natural convection cooling. Additional airflow and PCB copper
area reduces R
θJA. For more information see the
Section 10.3 section.
(3) The junction-to-top board characterization parameter,
ψJT, estimates the junction temperature, TJ, of a
device in a real system, using a procedure described in JESD51-2A (section 6 and
7). TJ = ψJT × Pdis + TT; where Pdis is the
power dissipated in the device and TT is the temperature of the top
of the device.
(4) The junction-to-board characterization parameter, ψJB,
estimates the junction temperature, TJ, of a device in a real system,
using a procedure described in JESD51-2A (sections 6 and 7). TJ =
ψJB × Pdis + TB; where Pdis is the power dissipated in
the device and TB is the temperature of the board 1mm from the
device.