ZHCSNG0A April 2023 – April 2024 TPS929160-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
-
6 Detailed Description
- 6.1 Overview
- 6.2 Functional Block Diagram
- 6.3
Feature Description
- 6.3.1 Device Bias and Power
- 6.3.2 Constant Current Output
- 6.3.3 PWM Dimming
- 6.3.4 FAIL-SAFE State Operation
- 6.3.5 On-Chip, 8-Bit, Analog-to-Digital Converter (ADC)
- 6.3.6 NSTB Output
- 6.3.7
Diagnostic and Protection in NORMAL State
- 6.3.7.1 VBAT Undervoltage Lockout Diagnostics in NORMAL state
- 6.3.7.2 Low-Supply Warning Diagnostics in NORMAL State
- 6.3.7.3 Supply Undervoltage Diagnostics in NORMAL State
- 6.3.7.4 Reference Diagnostics in NORMAL state
- 6.3.7.5 Pre-Thermal Warning in NORMAL state
- 6.3.7.6 Overtemperature Protection in NORMAL state
- 6.3.7.7 Overtemperature Shutdown in NORMAL state
- 6.3.7.8 LED Open-Circuit Diagnostics in NORMAL state
- 6.3.7.9 LED Short-Circuit Diagnostics in NORMAL state
- 6.3.7.10 Single-LED Short-Circuit Detection in NORMAL state
- 6.3.7.11 EEPROM CRC Error in NORMAL state
- 6.3.7.12 Communication Loss Diagnostic in NORMAL state
- 6.3.7.13 Fault Masking in NORMAL state
- 55
- 6.3.8
Diagnostic and Protection in FAIL-SAFE states
- 6.3.8.1 Supply Undervoltage Lockout Diagnostics in FAIL-SAFE states
- 6.3.8.2 Low-Supply Warning Diagnostics in FAIL-SAFE states
- 6.3.8.3 Supply Undervoltage Diagnostics in FAIL-SAFE State
- 6.3.8.4 Reference Diagnostics in FAIL-SAFE states
- 6.3.8.5 Pre-Thermal Warning in FAIL-SAFE state
- 6.3.8.6 Overtemperature Protection in FAIL-SAFE state
- 6.3.8.7 Overtemperature Shutdown in FAIL-SAFE state
- 6.3.8.8 LED Open-Circuit Diagnostics in FAIL-SAFE state
- 6.3.8.9 LED Short-Circuit Diagnostics in FAIL-SAFE state
- 6.3.8.10 Single-LED Short-Circuit Detection in FAIL-SAFE state
- 6.3.8.11 EEPROM CRC Error in FAIL-SAFE state
- 6.3.8.12 Fault Masking in FAIL-SAFE state
- 69
- 6.3.9 OFAF Setup In FAIL-SAFE state
- 6.3.10 ERR Output
- 6.4 Device Functional Modes
- 6.5 Programming
- 6.6 Register Maps
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- DCP|38
散熱焊盤機械數據 (封裝 | 引腳)
- DCP|38
訂購信息
6.3.2.1 Reference Current with External Resistor (REF)
The TPS929160-Q1 must have an external resistor R(REF) to set the internal current reference I(REF) as shown in Figure 6-1.
Figure 6-1 Output Current SettingThe internal current reference, I(FULL_RANGE), is generated based on the I(REF) multiplied by factor K(REF) to provide the full range current reference for each OUTXn channel. The K(REF) is programmable by 2-bit register REFRANGE with four different options. Use the following equation to calculate the I(FULL_RANGE).
where
- V(REF) = 1.235V typically
- K(REF) = 64, 128, 256, or 512 (default)
The following table lists the recommended resistor values of R(REF) and amplifier ratios of K(REF).
| REFRANGE | K(REF) | FULL RANGE CURRENT (mA) | |||
|---|---|---|---|---|---|
| R(REF) = 6.3kΩ | R(REF) = 8.45kΩ | R(REF) = 12.7kΩ | R(REF) = 31.6kΩ | ||
| 11b(default) | 512 | 100 | 75 | 50 | 20 |
| 10b | 256 | 50 | 37.5 | 25 | 10 |
| 01b | 128 | 25 | 18.75 | 12.5 | 5 |
| 00b | 64 | 12.5 | 9.375 | 6.25 | 2.5 |
Place the R(REF) resistor as close as possible to the REF pin with an up to 2.2-nF ceramic capacitor in parallel to improve the noise immunity. The off-board R(REF) setup is not allowed due to the concern of instability reference current. TI recommends a 1-nF ceramic capacitor in parallel with R(REF).