SLUSE50 November 2023 TPS92642-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | DEVICE | UNIT | |
|---|---|---|---|
| PKG (HTSSOP) | |||
| PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 38.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 24.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 19.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.7 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 19.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.7 | °C/W |