ZHCSCJ5A June 2014 – June 2014 TPS82740A , TPS82740B
PRODUCTION DATA.
- 1 特性
- 2 應用范圍
- 3 說明
- 4 典型應用
- 5 修訂歷史記錄
- 6 Device Comparison Table
- 7 Pin Configuration and Functions
- 8 Specifications
- 9 Parameter Measurement Information
- 10Detailed Description
- 11Application and Implementation
- 12Power Supply Recommendations
- 13Layout
- 14器件和文檔支持
- 15機械封裝和可訂購信息
13 Layout
13.1 Layout Guidelines
In making the pad size for the uSiP LGA balls, it is recommended that the layout use a non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 45 shows the appropriate diameters for a MicroSiPTM layout. Figure 46 shows a suggestion for the PCB layout.
13.2 Layout Example
Figure 45. Recommended Land Pattern Image and Dimensions
| SOLDER PAD DEFINITIONS(1)(2)(3)(4) | COPPER PAD | SOLDER MASK (5)
OPENING |
COPPER THICKNESS | STENCIL (6)
OPENING |
STENCIL THICKNESS |
|---|---|---|---|---|---|
| Non-solder-mask defined (NSMD) | 0.30mm | 0.360mm | 1oz max (0.032mm) | 0.34mm diameter | 0.1mm thick |
Figure 46. PCB Layout Suggestion
13.3 Surface Mount Information
The TPS82740 MicroSIP™ module uses an open frame construction for a fully automated assembly process and provides a large surface area for pick and place operations. See the "Pick Area" in the package drawing.
Package height and weight have been kept to a minimum, allowing MicroSIP™ device handling similar to a 0805 footprint component.
For reflow recommendations, see document J-STD-20 from the JEDEC/IPC standard.