The output current of the TPS82130 must be derated when the device operates in a high ambient temperature or delivers high output power. The amount of current derating is dependent upon the input voltage, output power, PCB layout design, and environmental thermal condition. Care must especially be taken in applications where the localized PCB temperature exceeds 65°C.

The TPS82130 module temperature must be kept less than the maximum rating of 125°C. Three basic approaches for enhancing thermal performance are below:

• Improve the power dissipation capability of the PCB design.
• Improve the thermal coupling of the TPS82130 to the PCB.
• Introduce airflow into the system.

To estimate approximate module temperature of TPS82130, apply the typical efficiency stated in this data sheet to the desired application condition to find the power dissipation of the module. Then, calculate the module temperature rise by multiplying the power dissipation by its thermal resistance. For more details on how to use the thermal parameters in real applications, see the Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs application report and Semiconductor and IC Package Thermal Metrics application report.