ZHCSRP2B February 2023 – December 2023 TPS7H3302-SEP , TPS7H3302-SP
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TPS7H3302-SEP | UNIT | |
|---|---|---|---|
| HTSSOP DAP | |||
| 32-PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 25.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 15.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 7.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 7.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.1 | °C/W |