ZHCSGF3B July 2017 – January 2019 TPS7A92
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSK|10
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSK|10
訂購信息
8.1.5 Estimating Junction Temperature
The JEDEC standard now recommends the use of psi (Ψ) thermal metrics to estimate the junction temperatures of the LDO when in-circuit on a typical PCB board application. These metrics are not strictly speaking thermal resistances, but rather offer practical and relative means of estimating junction temperatures. These psi metrics are determined to be significantly independent of the copper-spreading area. The key thermal metrics (ΨJT and ΨJB) are given in the Thermal Information table and are used in accordance with Equation 8.
where
- PD is the power dissipated as explained in Equation 6
- TT is the temperature at the center-top of the device package and
- TB is the PCB surface temperature measured 1 mm from the device package and centered on the package edge
For a more detailed discussion on thermal metrics and how to use them, see the Semiconductor and IC Package Thermal Metrics application report.