ZHCSHB7B September 2017 – July 2018 TPS7A53-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
-
8 Application and Implementation
- 8.1
Application Information
- 8.1.1 Recommended Capacitor Types
- 8.1.2 Soft Start and Inrush Current
- 8.1.3 Optimizing Noise and PSRR
- 8.1.4 Charge Pump Noise
- 8.1.5 Current Sharing
- 8.1.6 Adjustable Operation
- 8.1.7 Power-Good Operation
- 8.1.8 Undervoltage Lockout (UVLO) Operation
- 8.1.9 Dropout Voltage (VDO)
- 8.1.10 Device Behavior During Transition From Dropout Into Regulation
- 8.1.11 Load Transient Response
- 8.1.12 Reverse Current Protection Considerations
- 8.1.13 Power Dissipation (PD)
- 8.1.14 Estimating Junction Temperature
- 8.2 Typical Application
- 8.1
Application Information
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RGR|20
訂購信息
8.1.14 Estimating Junction Temperature
The JEDEC standard now recommends the use of psi (Ψ) thermal metrics to estimate the junction temperatures of the LDO when in-circuit on a typical PCB board application. These metrics are not strictly speaking thermal resistances, but rather offer practical and relative means of estimating junction temperatures. These psi metrics are determined to be significantly independent of the copper-spreading area. The key thermal metrics (ΨJT and ΨJB) are used in accordance with Equation 8 and are given in the Electrical Characteristics table.
Equation 8. 
where
- PD is the power dissipated as explained in Equation 5
- TT is the temperature at the center-top of the device package, and
- TB is the PCB surface temperature measured 1 mm from the device package and centered on the package edge