ZHCSSM4E August   1999  – March 2024 TPS766

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 應(yīng)用
4. 3 說明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information (Legacy Chip)
   5. 5.5 Thermal Information (New Chip)
   6. 5.6 Electrical Characteristics
   7. 5.7 Timing Diagram
   8. 5.8 Typical Characteristics
   9. 5.9 Typical Characteristics: Supported ESR Range
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagrams
   3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Power-Good Function
      6. 6.3.6 Output Pulldown
      7. 6.3.7 Thermal Shutdown
   4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
8. 7 Application and Implementation
   1. 7.1 Application Information
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
         1. 7.2.2.1 Adjustable Device Feedback Resistors
         2. 7.2.2.2 Recommended Capacitor Types
         3. 7.2.2.3 Input and Output Capacitor Requirements
         4. 7.2.2.4 Reverse Current
         5. 7.2.2.5 Feed-Forward Capacitor (CFF)
         6. 7.2.2.6 Power Dissipation (PD)
         7. 7.2.2.7 Estimating Junction Temperature
      3. 7.2.3 Application Curves
   3. 7.3 Power Supply Recommendations
   4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
9. 8 Device and Documentation Support
   1. 8.1 Documentation Support
      1. 8.1.1 Device Nomenclature
   2. 8.2 接收文檔更新通知
   3. 8.3 支持資源
   4. 8.4 Trademarks
   5. 8.5 靜電放電警告
   6. 8.6 術(shù)語表
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information