ZHCSFF4C February 2016 – August 2021 TPS65981
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
The TPS65981 has both a central thermal shutdown to the chip and a local thermal shutdown for the power path block. The central thermal shutdown monitors the temperature of the center of the die and disables all functions except for supervisory circuitry and halts digital core when die temperature goes above a rising temperature of TSD_MAIN. The temperature shutdown has a hysteresis of TSDH_MAIN and when the temperature falls back below this value, the device resumes normal operation. The power path block has a local thermal-shutdown circuit to detect an over temperature condition because of over current and quickly turn off the power switches. The power path thermal shutdown values are TSD_PWR and TSDH_PWR. The output of the thermal-shutdown circuit is de-glitched by TSD_DG before triggering. The thermal-shutdown circuits interrupt to the digital core.