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SLVS530D SEPTEMBER 2005 – October 2015 TPS63700

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

DRC|10
- MPDS117L

散熱焊盤機械數據 (封裝 | 引腳)

DRC|10
- QFND013N

訂購信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range unless otherwise noted⁽¹⁾

	MIN	MAX	UNIT
Input voltage at VIN⁽²⁾	–0.3	6	V
Input voltage at IN⁽²⁾		VIN	V
Minimum voltage at OUT ⁽²⁾		–18	V
Voltage at EN, FB, COMP, PS_GND ⁽²⁾	–0.3	V_IN + 0.3	V
Differential voltage between OUT to VIN ⁽²⁾		24	V
Operating virtual junction temperature, T_J	–40	150	°C
Storage temperature, T_stg	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal, unless otherwise noted.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

	MIN	MAX	UNIT
Input voltage range, V_IN	2.7	5.5	V
Operating free-air temperature, T_A	–40	85	°C
Operating virtual junction temperature, T_J	–40	125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPS63700	UNIT
		DRC (VSON)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	41.2	°C/W
R_θJC(top)	Junction-to-case(top) thermal resistance	62.8	°C/W
R_θJB	Junction-to-board thermal resistance	16.6	°C/W
ψ_JT	Junction-to-top characterization parameter	1.2	°C/W
ψ_JB	Junction-to-board characterization parameter	16.8	°C/W
R_θJC(bot)	Junction-to-case(bottom) thermal resistance	4.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

–40°C to 85°C, over recommended input voltage range, typical at an ambient temperature of 25°C (unless otherwise noted)

PARAMETER⁽¹⁾			TEST CONDITIONS	MIN	TYP	MAX	UNIT
SUPPLY
V_IN	Input voltage range		Pin VIN, IN	2.7		5.5	V
I_(Q)	Quiescent current	VIN	V_IN = 3.6 V, I_OUT = 0, EN = V_IN, no switching V_OUT = –5 V		330	400	μA
I_(Q)	Quiescent current	IN			640	750	μA
I_SD	Shutdown supply current		EN = GND		0.2	1.5	μA
UVLO	Undervoltage lockout threshold			2.1	2.35	2.7	V
T_SD	Thermal shutdown temperature				150		°C
T_SD	Thermal Shutdown hysteresis		Junction temperature decreasing		5		°C
CONTROL STAGE
V_EN	High level input voltage			1.4			V
V_EN	Low level input voltage					0.4	V
I_EN	Input current		EN = V_IN or GND		0.01	0.1	μA
POWER SWITCH
I_LIM	Inverter switch current limit		2.7 V < V_IN < 5.5 V	860	1000	1140	mA
R_DS(ON)	Inverter switch on-resistance		V_IN = 3.6 V		440	600	mΩ
R_DS(ON)	Inverter switch on-resistance		V_IN = 5 V		370	500	mΩ
D_MAX	Maximum duty cycle inverting converter				87.5%
D_MIN	Minimum duty cycle inverting converter				12.5%
f_S	Oscillator frequency			1250	1380	1500	kHz
OUTPUT
V_OUT	Adjustable output voltage range			–15		–2	V
V_OUT	DC output accuracy		PWM mode, device switching		±3%
V_REF	Reference voltage		I_REF = 10 μA	1.2	1.213	1.225	V
V_OVP	Output overvoltage protection				–19		V
V_FB	Negative feedback regulation voltage		V_IN = 2.7 V to 5.5 V	–0.024	0	0.024	V
I_FB	Negative feedback input bias current		V_FBN = 0.1 V_REF		2		nA

(1) Parameter does not include tolerance of external resistors.

6.6 Typical Characteristics

Figure 1. Maximum Output Current vs Input Voltage