SLVS696D October 2008 – April 2020 TPS63030 , TPS63031
PRODUCTION DATA.
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.
The follow are three basic approaches for enhancing thermal performance:
For more details on how to use the thermal parameters in the dissipation ratings table, check the Thermal Characteristics Application Note and the Semiconductor and IC Package Thermal Metrics Application Note.