ZHCSO00A March 2022 – March 2023 TPS629211-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TPS629211-Q1 | UNIT | ||
|---|---|---|---|---|
| SOT583 8-Pin (DYC) | ||||
| JEDEC PCB | TPS6292xx DYC EVM | |||
| RθJA | Junction-to-ambient thermal resistance | 105 | 55 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 45 | n/a | °C/W |
| RθJB | Junction-to-board thermal resistance | 22 | n/a | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1 | n/a | °C/W |
| ΨJB | Junction-to-board characterization parameter | 18 | n/a | °C/W |