ZHCSM66 March   2022 TPS629206-Q1

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Mode Selection and Device Configuration (MODE/S-CONF Pin)
      2. 8.3.2 Adjustable VO Operation (External Voltage Divider)
      3. 8.3.3 Selectable VO Operation (VSET and Internal Voltage Divider)
      4. 8.3.4 Smart Enable with Precise Threshold
      5. 8.3.5 Power Good (PG)
      6. 8.3.6 Output Discharge Function
      7. 8.3.7 Undervoltage Lockout (UVLO)
      8. 8.3.8 Current Limit and Short Circuit Protection
      9. 8.3.9 Thermal Shutdown
   4. 8.4 Device Functional Modes
      1. 8.4.1 Forced Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation (Auto PFM/PWM)
      3. 8.4.3 AEE (Automatic Efficiency Enhancement)
      4. 8.4.4 100% Duty-Cycle Operation
      5. 8.4.5 Starting into a Prebiased Load
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
         1. 9.2.2.1 Custom Design With WEBENCH? Tools
         2. 9.2.2.2 Programming the Output Voltage
         3. 9.2.2.3 External Component Selection
            1. 9.2.2.3.1 Output Filter and Loop Stability
            2. 9.2.2.3.2 Inductor Selection
            3. 9.2.2.3.3 Capacitor Selection
               1. 9.2.2.3.3.1 Output Capacitor
               2. 9.2.2.3.3.2 Input Capacitor
      3. 9.2.3 Application Curves
   3. 9.3 System Examples
      1. 9.3.1 Powering Multiple Loads
      2. 9.3.2 Inverting Buck-Boost (IBB)
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
       1. 11.2.1 Thermal Considerations
12. 12Device and Documentation Support
    1. 12.1 Device Support
       1. 12.1.1 第三方產(chǎn)品免責(zé)聲明
       2. 12.1.2 Development Support
          1. 12.1.2.1 Custom Design With WEBENCH? Tools
    2. 12.2 Documentation Support
       1. 12.2.1 Related Documentation
    3. 12.3 接收文檔更新通知
    4. 12.4 支持資源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 術(shù)語(yǔ)表
13. 13Mechanical, Packaging, and Orderable Information