ZHCSJB0D January 2019 – July 2021 TPS61022
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
10.3 Thermal Considerations
Restrict the maximum IC junction temperature to 125°C under normal operating conditions. Calculate the maximum allowable dissipation, PD(max), and keep the actual power dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using Equation 11.
where
- TA is the maximum ambient temperature for the application
- RθJA is the junction-to-ambient thermal resistance given in Thermal Information
The TPS61022 comes in a VQFN package. This package includes three power pads that improves the thermal capabilities of the package. The real junction-to-ambient thermal resistance of the package greatly depends on the PCB type, layout, and thermal pad connection. Using larger and thicker PCB copper for the power pads (GND, SW, and VOUT) to enhance the thermal performance. Using more vias connects the ground plate on the top layer and bottom layer around the IC without solder mask also improves the thermal capability.