ZHCSM62C September 2020 – December 2021 TPS542A50
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Enable and Adjustable Undervoltage Lockout
- 7.3.2 Input and VREG Undervoltage Lockout Protection
- 7.3.3 Voltage Reference and Setting the Output Voltage
- 7.3.4 Remote Sense Function
- 7.3.5 Switching Frequency
- 7.3.6 Voltage Control Mode Internal Compensation
- 7.3.7 Soft Start and Prebiased Output Start-up
- 7.3.8 Power Good
- 7.3.9 Overvoltage and Undervoltage Protection
- 7.3.10 Overcurrent Protection
- 7.3.11 High-Side FET Throttling
- 7.3.12 Overtemperature Protection
- 7.4 Device Functional Modes
- 7.5 Programming
- 7.6 Pin-Strap Programming
- 7.7
Register Maps
- 7.7.1 ID Register (Offset = 0x0) [reset = 0x21]
- 7.7.2 STATUS Register (Offset = 0x1) [reset = 0x0]
- 7.7.3 VOUT_ADJ1 Register (Offset = 0x2) [reset = 0x0]
- 7.7.4 VOUT_ADJ2 Register (Offset = 0x3) [reset = 0x0]
- 7.7.5 CONFIG1 Register (Offset = 0x4) [reset = 0x0B]
- 7.7.6 CONFIG2 Register (Offset = 0x5) [reset = 0x2D]
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1
Full Analog Configuration
- 8.2.1.1 Design Requirements
- 8.2.1.2
Detailed Design Procedure
- 8.2.1.2.1 Custom Design With WEBENCH? Tools
- 8.2.1.2.2 Output Voltage Calculation
- 8.2.1.2.3 Switching Frequency Selection
- 8.2.1.2.4 Inductor Selection
- 8.2.1.2.5 Input Capacitor Selection
- 8.2.1.2.6 Bootstrap Capacitor Selection
- 8.2.1.2.7 R-C Snubber and VIN Pin High-Frequency Bypass
- 8.2.1.2.8 Output Capacitor Selection
- 8.2.1.2.9 Response to a Load Transient
- 8.2.1.2.10 Pin-Strap Setting
- 8.2.1.3 Application Curves
- 8.2.1.4 Typical Application Circuits
- 8.2.1
Full Analog Configuration
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RJM|33
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
11.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |